ITF Belgium > Program > Speakers  > Hideto Hidaka
Share
linkedin twitter facebook email

 

Hideto Hidaka    
   

 

Bio

HIDETO HIDAKA, RENESAS ELECTRONICS
CTO & SENIOR VP

Hideto Hidaka earned the B.S., M.S., and Ph.D. degrees in electronic engineering from the University of Tokyo. In Mitsubishi Electric, Renesas Technology and Renesas Electronics, he was engaged in the R&D of high-density and embedded aspects of DRAM technology, and embedded-flash memory and non-volatile memory technologies for MCU applications. He is now a Senior Vice-President and Chief Technology Officer of Renesas Electronics Corp.

While he was responsible for R&D in all the embedded non-volatile memory technology for MCU products, he led a trend-setting development to create the world's first split-gate SONOS flash memory for MCUs in automotive applications for performance, power and reliability and to make a de-facto standard in MCU products, from 90nm through 28 nm generations, thus leading the MCU technology and business strategies in Renesas Electronics.

He was the Program Chair of the ISSCC (2011-12) and was an IEEE-SSCS Distinguished Lecturer (2015–2016). He is an IEEE-SSCS AdCom member, an Associate Editor of JSSC and an IEEE Fellow.

 

Back to session

Presentation abstract

EMBEDDED SYSTEM DESIGNS MEET MOBILITY APPLICATIONS

In the modern automotive technology where control (on mobility/energy in physical-world) meets IT (by information in cyber-world), we explore every capability of efficiency /performance /cost breakthroughs based on existing technology revisited with newer system challenges by embedded mobility requirements. Essential new embedded-system technologies triggered by functionality requirements in cyber-physical systems has a long list; functional safety, sensing and real-time feedback, connectivity, security, extremely low-power and AI implementation. These new requirements force existing embedded system technologies to be totally re-examined for future expansion of markets.

On top of these essential sub-system technologies mostly shared by mobility control, Industry 4.0, and trillion sensory systems by IoT, a new challenge for Y2030 should be the extensive system-wide knowledge and design through the cyber and physical systems (CPS) in solid platforms for better use of existing and future semiconductor technologies. Introduction of AI system is likely to help solve this problem.

We explore solutions to new requirements in embedded-system designs as well as base technology capabilities by HW and SW platforms for secure, highly reliable, and low-power properties, and possible approaches to semiconductor roadmaps.

 

Back to program

Back to speakers

 

Copyright imec 2017