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Flexible Packaging for Wafer-Based Devices using Conformal Structures Technology

For the past decades, electronic devices have enjoyed tremendous improvements in terms of energy consumption and performance. But the same progress has not (yet) been made in the field of large-area electronics.  

Imec’s innovative Conformal Structure Method (CSM) provides a cost-efficient, precise and fast alternative to transfer high-performance wafer-based devices to foreign substrates en masse at various pitches in bare die form, enabling conventional semiconductor devices to be delivered in a 2D-flexible and semi-transparent package by means of a cost-effective process.
It is a proven solution that can solve several bottlenecks that exist in today’s packaging for wafer-based devices for large-area electronics applications.

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